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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: AM27C128-250 BXA
Alternate P/N: AM27C128250BXA
NSN : 5962-01-300-0495
NIIN : 013000495
CAGE Code : 34335
Manufacturer: Advanced Micro Devices Inc
Item Name : Microcircuit Memory
If you’re in need of NSN parts, look no further than NSN Orbit. Owned and operated by ASAP Semiconductor, we have access to an unparalleled inventory of parts and components for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from Advanced Micro Devices Inc, as well as part numbers like AM27C128-250 BXA and many more. NSN Orbit has more than two billion new and obsolete parts readily available with short lead times and competitive prices, and as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a strict No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers an array of parametric search capabilities that allow our customers to search for parts through a number of filters, one of which is the National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. NSN Orbit has a broad selection of NSN parts such as 5962013000495 from manufacturers like Advanced Micro Devices Inc. To begin the purchasing process immediately, submit an RFQ today for part number AM27C128-250 BXA.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-300-0495 Item Description: Microcircuit Memory | 5962 | 013000495 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Am27c128-250 Bxa | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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