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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: 5E8071 253C1146
Alternate P/N: 5E8071253C1146
NSN : 5962-01-225-0600
NIIN : 012250600
CAGE Code : 73030
Manufacturer: Hamilton Sundstrand Corporation
Item Name : Microcircuit Memory
If you’re in need of NSN parts, look no further than NSN Orbit. Owned and operated by ASAP Semiconductor, we have access to an unparalleled inventory of parts and components for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from Hamilton Sundstrand Corporation, as well as part numbers like 5E8071 253C1146 and many more. NSN Orbit has more than two billion new and obsolete parts readily available with short lead times and competitive prices, and as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a strict No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers an array of parametric search capabilities that allow our customers to search for parts through a number of filters, one of which is the National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. NSN Orbit has a broad selection of NSN parts such as 5962012250600 from manufacturers like Hamilton Sundstrand Corporation. To begin the purchasing process immediately, submit an RFQ today for part number 5E8071 253C1146.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-225-0600 Item Description: Microcircuit Memory | 5962 | 012250600 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 5e8071 253c1146 | 2 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 750.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 150.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 9 INPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ | BODY LENGTH | 0.930 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.095 INCHES NOMINAL |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND 3-STATE OUTPUT AND PROGRAMMABLE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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