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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: SCD0326
NSN : 5962-01-248-5010
NIIN : 012485010
CAGE Code : 61772
Manufacturer: Integrated Device Technology Inc
Item Name : Microcircuit Memory
If you’re in need of NSN parts, look no further than NSN Orbit. Owned and operated by ASAP Semiconductor, we have access to an unparalleled inventory of parts and components for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from Integrated Device Technology Inc, as well as part numbers like SCD0326 and many more. NSN Orbit has more than two billion new and obsolete parts readily available with short lead times and competitive prices, and as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a strict No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers an array of parametric search capabilities that allow our customers to search for parts through a number of filters, one of which is the National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. NSN Orbit has a broad selection of NSN parts such as 5962012485010 from manufacturers like Integrated Device Technology Inc. To begin the purchasing process immediately, submit an RFQ today for part number SCD0326.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-248-5010 Item Description: Microcircuit Memory | 5962 | 012485010 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Scd0326 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAU | BODY HEIGHT | 0.085 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFJQ | STORAGE TEMP RANGE | 65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| ADAQ | BODY LENGTH | 0.425 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.290 INCHES NOMINAL |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
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