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Quality guaranteed We sell only warrantied and traceable partsMfg Part Number: G308302-1
Alternate P/N: G3083021
NSN : 5962-01-249-4639
NIIN : 012494639
CAGE Code : 3B150
Manufacturer: Raytheon Technical Services Comp
Item Name : Microcircuit Memory
If you’re in need of NSN parts, look no further than NSN Orbit. Owned and operated by ASAP Semiconductor, we have access to an unparalleled inventory of parts and components for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from Raytheon Technical Services Comp, as well as part numbers like G308302-1 and many more. NSN Orbit has more than two billion new and obsolete parts readily available with short lead times and competitive prices, and as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a strict No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers an array of parametric search capabilities that allow our customers to search for parts through a number of filters, one of which is the National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. NSN Orbit has a broad selection of NSN parts such as 5962012494639 from manufacturers like Raytheon Technical Services Comp. To begin the purchasing process immediately, submit an RFQ today for part number G308302-1.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-249-4639 Item Description: Microcircuit Memory | 5962 | 012494639 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| G308302-1 | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 614.4 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND BIPOLAR AND HERMETICALLY SEALED AND SCHOTTKY AND PROGRAMMABLE AND 3-STATE OUTPUT |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ABKW | OVERALL HEIGHT | 0.290 INCHES MINIMUM AND 0.380 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.300 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.302 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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